Control device for substrate treatment apparatus, substrate treatment apparatus, and display control device

ABSTRACT

The present invention efficiently executes a plurality of functions of a substrate treatment apparatus. A control device  5  includes: a plurality of software applications (interface-related APSW  510  and control-related APSW  520 ) configured to execute each function of treatments concerning a CMP apparatus; and a shared memory  540  which stores information that is used in the plurality of software applications therein. The plurality of software applications include a task monitoring software application  530  which monitors whether abnormality has occurred in the plurality of software applications or not. The task monitoring software application  530  restarts the software application in which the abnormality has occurred, when the abnormality has occurred in any of the plurality of software applications, and makes the other software applications continue the respective processes.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. application Ser. No.14/590,931, filed Jan. 6, 2015, which claims priority to Japanese PatentApplication No. 2014-001091, filed Jan. 7, 2014, Japanese PatentApplication No. 2014-019436, filed Feb. 4, 2014, and Japanese PatentApplication No. 2014-019437, filed Feb. 4, 2014, the entire contents ofwhich are incorporated herein by reference.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to a control device for a substratetreatment apparatus, a substrate treatment apparatus, and a displaycontrol device.

Description of the Related Art

In recent years, a substrate treatment apparatus is used for subjectinga substrate such as a semiconductor wafer to various treatments. Oneexample of the substrate treatment apparatus includes a CMP (ChemicalMechanical Polishing) apparatus for performing a polishing treatment ofa substrate.

The CMP apparatus includes: a polishing unit for performing a polishingtreatment of a substrate; a cleaning unit for performing a cleaningtreatment and a drying treatment of the substrate; and aloading/unloading unit for delivering the substrate to the polishingunit and also receiving the substrate which has been subjected to thecleaning treatment and the drying treatment in the cleaning unit. Inaddition, the CMP apparatus includes a conveying unit which conveys thesubstrate in the polishing unit, the cleaning unit, and theloading/unloading unit. The CMP apparatus subjects the substratesequentially to various treatments of the polishing, cleaning and dryingtreatments, while conveying the substrate by the conveying unit.

Incidentally, a control device is connected to the substrate treatmentapparatus such as the CMP apparatus, and the control device performsvarious controls concerning the substrate treatment apparatus. Softwareapplication is installed in the control device. The software applicationperforms various controls, for instance, such as an edit of variousinformation (for instance, recipe and the like) concerning the substratetreatment, and an operation for testing the unit of the substratetreatment apparatus.

In addition, the substrate treatment apparatus is provided with a PC foroperation, in order that a user monitors the state of the substratetreatment apparatus or performs various operations. A display device(user interface) of the PC for the operation displays amonitoring-related image and an operation-related image, for instance.The monitoring-related image is an image for monitoring how thesubstrate treatment apparatus operates. The operation-related image isan image which a user uses for performing various operations such as anoperation for the substrate, a job operation and a recipe edit. The usermonitors the state of the substrate treatment apparatus and performsvarious operations through the display device of the PC for theoperation.

In addition, in the CMP apparatus, a substrate conveying test isperformed for confirming whether the substrate is properly conveyed inthe CMP apparatus or not, in addition to a main operation of actuallysubjecting the substrate to treatments such as polishing and cleaning.

The substrate conveying test is generally a test of arranging a carrierwhich accommodates a substrate for a test therein, in a predeterminedplace, subjecting the carrier to loading treatment, thereby approachingthe carrier to the CMP apparatus, and docking the carrier with the CMPapparatus. Subsequently, the substrate conveying test continuesexecuting a job concerning the test conveyance for the substrate,thereby taking out the substrate from the carrier, conveying thesubstrate in the CMP apparatus, and returning the substrate which hasbeen conveyed to the carrier. Subsequently, the substrate conveying testsubjects the carrier to unloading treatment, thereby moving the carrieraway from the CMP apparatus, and returning the carrier to thepredetermined place.

CITATION LIST Patent Literature

Patent Literature 1: Japanese Patent No. 3949096

Patent Literature 2: Japanese Patent Laid-Open No. 2005-85784

Patent Literature 3: Japanese Patent Laid-Open No. 2010-103486

In a conventional technology, it has not been considered to efficientlyexecute a plurality of functions of the substrate treatment apparatus.

Specifically, in a conventional control device, various functions whichare executed by the control device have been achieved by one softwareapplication. In this case, when abnormality has occurred in thissoftware application, for instance, all of the plurality of functions ofthe substrate treatment apparatus have become incapable of beingexecuted until the substrate treatment apparatus is recovered by arestart of the software application, or the like.

For this reason, as for one aspect of the present invention, an objectis to efficiently execute the plurality of functions of the substratetreatment apparatus.

However, in the conventional technology, it has not been considered toenhance the usability concerning the user interface of the substratetreatment apparatus.

In other words, in the substrate treatment apparatus, there existvarious operation states (execution of process in each unit, automaticconveyance test for substrate, assembly of substrate treatmentapparatus, and the like). On the other hand, in the conventionaltechnology, the size and the arrangement position of the image which isdisplayed on the display device have been fixed at a default value,regardless of the type of operation. For instance, themonitoring-related image is arranged in a left-half region of a screenof the display device, and the operation-related image is arranged in aright-half region thereof; and it has been difficult to adjust the sizeor the arrangement position of each of the images. As a result, it hasbeen difficult for a user to achieve optimal image arrangement whichmatches the type of the operation of the substrate treatment apparatus,and the usability of a user interface has been poor.

For this reason, in one aspect of the present invention, an object is toenhance the usability concerning the user interface of the substratetreatment apparatus.

In addition, in a conventional technology, it has not been considered toefficiently execute a plurality of jobs concerning the test conveyanceof the substrate.

In other words, in the conventional technology, when one job isexecuted, loading treatment and unloading treatment for the carrier areincluded. Because of this, when the plurality of jobs are continuouslyexecuted, the loading treatment and the unloading treatment for thecarrier exist between the executions of each of the jobs. As a result,the above circumstance has hindered the plurality of jobs from beingefficiently executed.

For this reason, in one aspect of the present invention, an object is toefficiently execute the plurality of jobs concerning the test conveyanceof the substrate. One aspect of the present invention is to solve atleast one of the above described plurality of objects.

SUMMARY OF THE INVENTION

One aspect of the control device of the substrate treatment apparatus ofthe present invention has been designed with respect to the abovedescribed problems, and includes: a plurality of software applicationsconfigured to execute each function of treatments concerning thesubstrate treatment apparatus; and a storage device configured to storeinformation that is used in the plurality of software applicationstherein, wherein the plurality of software applications include amonitoring software application which monitors whether abnormality hasoccurred in the plurality of software applications or not, wherein themonitoring software application restarts the software application inwhich the abnormality has occurred, when the abnormality has occurred inany of the plurality of software applications, and makes the othersoftware applications continue the respective processes.

In one aspect of the control device of the substrate treatment apparatusof the present invention, the control device further includes a displaydevice which functions as an interface of information, wherein theplurality of software applications include: an interface-relatedsoftware application configured to execute input and output processes ofthe information through the display device; and a control-relatedsoftware application configured to execute an operation process of thesubstrate treatment apparatus on the basis of the input informationwhich has been input by the interface-related software application, or astorage process of the input information into the storage device; andthe monitoring software application can restart the software applicationin which the abnormality has occurred, when the abnormality has occurredin any one of the interface-related software application and thecontrol-related software application, and make the other softwareapplication continue the processing.

In one aspect of the control device of the substrate treatment apparatusof the present invention, the interface-related software applicationincludes: at least two of a recipe-editing software applicationconfigured to edit recipes concerning the substrate treatment of thesubstrate treatment apparatus, a job-editing software applicationconfigured to edit jobs of the substrate treatment apparatus, which arecreated by combining the recipes, a unit adjustment software applicationconfigured to input a command for a test or adjustment of units includedin the substrate treatment apparatus, and a parameter-editing softwareapplication configured to edit parameters which are used in thesubstrate treatment apparatus, wherein the monitoring softwareapplication can restart the software application in which theabnormality has occurred, when the abnormality has occurred in any of atleast two in the recipe-editing software application, the job-editingsoftware application, the unit adjustment software application and theparameter-editing software application, and make the other softwareapplications continue the processing.

In one aspect of the control device of the substrate treatment apparatusof the present invention, the control-related software applicationincludes: at least two of a recipe management software applicationconfigured to store recipes which have been edited through therecipe-editing software application, into the storage device, a jobmanagement/control software application configured to store the jobswhich have been edited through the job-editing software application,into the storage device, and also make the substrate treatment apparatusoperate on the basis of the jobs, a unit operation software applicationconfigured to make a unit included in the substrate treatment apparatusoperate on the basis of a command which has been input through the unitadjustment software application, and a parameter management softwareapplication configured to store parameters which have been editedthrough the parameter-editing software application, into the storagedevice; wherein the monitoring software applications can restart thesoftware application in which the abnormality has occurred, when theabnormality has occurred in at least two in the recipe managementsoftware application, the job management/control software application,the unit operation software application and the parameter managementsoftware application, and make the other software applications continuethe processing.

One aspect of the substrate treatment apparatus of the present inventionincludes: any one of the above described control devices; a polishingunit configured to perform a polishing treatment of a substrate; acleaning unit configured to perform a cleaning treatment and a dryingtreatment of the substrate; and a loading/unloading unit configured todeliver the substrate to the polishing unit and also receive thesubstrate which has been subjected to the cleaning treatment and thedrying treatment in the cleaning unit.

One aspect of a display control device of the present invention has beendesigned with the above described problems, and includes: a receivingunit configured to receive a start-up command to software concerning theoperation of the substrate treatment apparatus; and a display controlunit configured to read out a plurality of images of differentfunctions, which correspond to the start-up command that has beenreceived by the receiving unit, from the storage unit, and make adisplay unit display the plurality of read out images, wherein thedisplay control unit is configured so as to be capable of adjusting thesizes or the arrangement positions of the plurality of images which havebeen displayed on the display unit, on the basis of an adjustmentinstruction that has been input through an input operation unit.

One aspect of the display control device further includes a storagecontrol unit configured to store the sizes and the arrangement positionsof the plurality of images that have been displayed on the display unitin the storage unit, while making the sizes and the arrangementpositions correspond to the type of the start-up command that has madethe display unit display the plurality of images, wherein the displaycontrol unit can read out the sizes and the arrangement positions of theplurality of images, which correspond to the type of the start-upcommand that has been received by the receiving unit, from the storageunit, and make the display unit display the plurality of images on thebasis of the read out sizes and arrangement positions of the pluralityof images.

One aspect of the display control device further includes a storagecontrol unit configured to store the sizes and the arrangement positionsof the plurality of images that have been displayed on the display unitin the storage unit, while making the sizes and the arrangementpositions correspond to the type of the start-up command that has madethe display unit display the plurality of images and an identifier thathas been input through the input operation unit, wherein the displaycontrol unit can read out the sizes and the arrangement positions of theplurality of images, which correspond to the type of the start-upcommand that has been received by the receiving unit, and the identifierthat has been input through the input operation unit, from the storageunit, and make the display unit display the plurality of images on thebasis of the read out sizes and arrangement positions of the pluralityof images.

In one aspect of the display control device, the plurality of imagesinclude a base image which is used in common regardless of the type ofthe start-up command, and the display control unit can make the displayunit display the base image with a fixed size and at a fixed arrangementposition, regardless of the type of the start-up command which has beenreceived by the receiving unit.

One aspect of the substrate treatment apparatus of the present inventionincludes: any one of the above described display control devices; apolishing unit configured to perform a polishing treatment of asubstrate; a cleaning unit configured to perform a cleaning treatmentand a drying treatment of the substrate; and a loading/unloading unitconfigured to deliver the substrate to the polishing unit, and alsoreceive the substrate which has been subjected to the cleaning treatmentand the drying treatment in the cleaning unit.

One aspect of the substrate treatment apparatus of the present inventionhas been designed with respect to the above described problems, andincludes: a treatment chamber configured to polish or clean a substratetherein; and a control device configured to continuously execute aplurality of jobs concerning a test conveyance of the substrate in thetreatment chamber, wherein the control device executes the plurality ofjobs continuously executed not through an unloading treatment of movinga carrier which accommodates the substrate therein away from thetreatment chamber, and not through a loading treatment of approachingthe carrier to the treatment chamber, between the plurality of jobs.

In one aspect of the substrate treatment apparatus of the presentinvention, the control device can continuously execute the plurality ofjobs in order of registration or at random.

In one aspect of the substrate treatment apparatus of the presentinvention, the carrier can accommodate a plurality of substratestherein, and the control device can execute the plurality of jobs to asubstrate which has been assigned by the plurality of jobs, out of aplurality of substrates that have been accommodated in the carrier.

In one aspect of the substrate treatment apparatus of the presentinvention, the control device can determine whether the carrier issubjected to the loading treatment or not, before the first job out ofthe plurality of jobs is executed, and when the carrier is not subjectedto the loading treatment, subject the carrier to the loading treatmentand execute the first job.

In one aspect of the substrate treatment apparatus of the presentinvention, the substrate treatment apparatus can set the number of thesubstrates to be conveyed or the finish time, as a termination conditionfor continuous execution of the plurality of jobs, and the controldevice can determine whether the termination condition is satisfied ornot while the plurality of jobs are continuously executed, and when thetermination condition has been satisfied, subject the carrier to theunloading treatment and finish the substrate test.

In one aspect of the substrate treatment apparatus of the presentinvention, the plurality of carriers are provided, and the controldevice can simultaneously execute the plurality of jobs to thesubstrates which are accommodated in each of the plurality of carriers.

According to one aspect of the present invention, a plurality offunctions of a substrate treatment apparatus can be efficientlyexecuted.

One aspect of the present invention can enhance the usability concerningthe user interface of the substrate treatment apparatus.

One aspect of the present invention can efficiently execute a pluralityof jobs concerning the test conveyance of the substrate. One aspect ofthe present invention shows at least one effect out of the abovedescribed plurality of effects.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing the whole structure of a substratetreatment apparatus of the present embodiment;

FIG. 2 is a perspective view schematically showing a polishing unit;

FIG. 3A is a plan view showing a cleaning unit;

FIG. 3B is a side view showing the cleaning unit;

FIG. 4 is a view showing configurations of a CMP apparatus and a controldevice (PC for operation);

FIG. 5 is a view showing a configuration of the control device;

FIG. 6A is a view showing one example of a screen which is displayed ona display device by an interface-related APSW;

FIG. 6B is a view showing one example of the screen which is displayedon the display device by the interface-related APSW;

FIG. 6C is a view showing one example of the screen which is displayedon the display device by the interface-related APSW;

FIG. 7 is a view showing a flow of processing by the control device;

FIG. 8 is a view showing configurations of a display control device andthe CMP apparatus;

FIG. 9 is a view showing one example of an image display shown by aconventional technology;

FIG. 10 is a view showing one example of an image display which has beenadjusted by the present embodiment;

FIG. 11 is a view showing one example of the image display which hasbeen adjusted by the present embodiment;

FIG. 12 is a view showing one example of the image display shown when anassembly and adjustment of the CMP apparatus is executed;

FIG. 13 is a view showing one example of an image display shown when theprocess treatment in a unit of the CMP apparatus is executed;

FIG. 14 is a view showing one example of an image display shown when anautomatic conveyance test of a substrate is executed in the CMPapparatus;

FIG. 15 is a view showing one example of the image display shown when atrouble has occurred during the process treatment in the CMP apparatus;

FIG. 16 is a flow chart of a processing which is executed by the displaycontrol device;

FIG. 17 is a flow chart of a processing which is executed by the displaycontrol device;

FIG. 18 is a flow chart of a processing which is executed by the displaycontrol device;

FIG. 19 is a flow chart of a processing which is executed by the displaycontrol device;

FIG. 20 is a view showing configurations of the CMP apparatus and thecontrol device (PC for operation); and

FIG. 21 is a view showing a flow of processing by the control device.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

A substrate treatment apparatus according to one embodiment of thepresent invention will be described below with reference to thedrawings. A CMP apparatus will be described below as one example of thesubstrate treatment apparatus, but the substrate treatment apparatus isnot limited to the CMP apparatus. In addition, the substrate treatmentapparatus will be described below which includes a loading/unloadingunit 2, a polishing unit 3 and a cleaning unit 4, but is not limited tothis substrate treatment apparatus.

Firstly, a structure of the CMP apparatus will be described below, andthen an efficient execution of a plurality of functions of the CMPapparatus will be described below.

<Substrate Treatment Apparatus>

FIG. 1 is a plan view showing the whole structure of a substratetreatment apparatus according to one embodiment of the presentinvention. As is shown in FIG. 1, this CMP apparatus has a housing 1which has an approximately rectangular shape. The inner part of thehousing 1 is divided into a loading/unloading unit 2, a polishing unit 3and a cleaning unit 4, by partition walls 1 a and 1 b. Theloading/unloading unit 2, the polishing unit 3 and the cleaning unit 4are each independently assembled, and are each independently exhausted.In addition, the cleaning unit 4 has a control device 5 which controlsan operation of substrate treatment.

<Loading/Unloading Unit>

The loading/unloading unit 2 has two or more (in the present embodiment,four) front loading portions 20 on which wafer cassettes each of whichstocks a large number of wafers (substrate) therein are mounted,respectively. These front loading portions 20 are arranged so as to beadjacent to the housing 1, and are arrayed in a width direction(direction perpendicular to longitudinal direction) of the substratetreatment apparatus. The front loading portion 20 is configured so as tobe capable of mounting an open cassette, an SMIF (Standard ManufacturingInterface) pod or a FOUP (Front Opening Unified Pod) thereon. Here, theSMIF and the FOUP are closed containers each of which accommodates thewafer cassette therein and can keep an environment independent from anouter space by being covered with a partition wall.

In addition, a travelling mechanism 21 is installed in theloading/unloading unit 2 along the alignment of the front loadingportions 20. Two conveyance robots (loader and conveyance mechanism) 22are provided on this travelling mechanism 21, which can move along adirection in which the wafer cassettes are arrayed. The conveying robot22 is structured so as to be capable of accessing the wafer cassettewhich is mounted on the front loading portion 20, by moving on thetravelling mechanism 21. Each of the conveying robots 22 has two handsin upper and lower parts. The upper hand is used when returning atreated wafer to the wafer cassette. The lower hand is used when takingout a wafer before treatment from the wafer cassette. Thus, the upperand lower hands are structured to be capable of being separately used.Furthermore, the lower hand of the conveying robot 22 is structured soas to be capable of inverting the wafer by rotating around the shaftcenter thereof.

The loading/unloading unit 2 is a region in which the cleanest stateneeds to be kept. For this reason, the inside of the loading/unloadingunit 2 is always kept at a higher pressure than any one of the outsideof the CMP apparatus, the polishing unit 3 and the cleaning unit 4. Thepolishing unit 3 is the dirtiest region because of using slurry as apolishing liquid. Accordingly, a negative pressure is formed in theinside of the polishing unit 3, and the pressure thereof is kept at alower pressure than the internal pressure of the cleaning unit 4. Afilter fan unit (unillustrated) which has a clean air filter such as aHEPA filter, an ULPA filter and a chemical filter is provided in theloading/unloading unit 2. Clean air from which particles, toxic vaporand toxic gas have been removed always blows out from this filter fanunit.

<Polishing Unit>

The polishing unit 3 is a region in which the wafer is polished(flattened). The polishing unit 3 has a first polishing unit 3A, asecond polishing unit 3B, a third polishing unit 3C and a fourthpolishing unit 3D. These first polishing unit 3A, second polishing unit3B, third polishing unit 3C and fourth polishing unit 3D are arrayed inthe longitudinal direction of the substrate treatment apparatus, as isshown in FIG. 1.

As is shown in FIG. 1, the first polishing unit 3A is provided with apolishing table 30A on which a polishing pad 10 having a polishingsurface is attached. The first polishing unit 3A is also provided with atop ring 31A for holding the wafer and polishing the wafer whilepressing the wafer against the polishing pad 10 on the polishing table30A. In addition, the first polishing unit 3A is provided with apolishing-liquid supply nozzle 32A for supplying the polishing liquidand a dressing liquid (for instance, pure water), to the polishing pad10. In addition, the first polishing unit 3A is provided with a dresser33A for dressing a polishing surface of the polishing pad 10. Inaddition, the first polishing unit 3A is provided with an atomizer 34Awhich converts a mixture fluid of a liquid (for instance, pure water)and a gas (for instance, nitrogen gas) or a liquid (for instance, purewater) into a mist form, and jets the mist onto the polishing surface.

Similarly, the second polishing unit 3B is provided with a polishingtable 30B on which the polishing pad 10 is attached, a top ring 31B, apolishing-liquid supply nozzle 32B, a dresser 33B and an atomizer 34B.The third polishing unit 3C is provided with a polishing table 30C onwhich the polishing pad 10 is attached, a top ring 31C, apolishing-liquid supply nozzle 32C, a dresser 33C and an atomizer 34C.The fourth polishing unit 3D is provided with a polishing table 30D onwhich the polishing pad 10 is attached, a top ring 31D, apolishing-liquid supply nozzle 32D, a dresser 33D and an atomizer 34D.

The first polishing unit 3A, the second polishing unit 3B, the thirdpolishing unit 3C and the fourth polishing unit 3D have the samestructure, and accordingly the first polishing unit 3A will be describedbelow.

FIG. 2 is a perspective view schematically showing the first polishingunit 3A. The top ring 31A is supported by a top ring shaft 36. Thepolishing pad 10 is affixed on the upper face of the polishing table30A, and the upper face of this polishing pad 10 constitutes a polishingsurface which polishes a wafer W. Incidentally, fixed abrasive grainscan also be used in place of the polishing pad 10. The top ring 31A andthe polishing table 30A are structured so as to rotate around therespective shaft centers, as are shown by the arrows. The wafer W isheld on the lower face of the top ring 31A by vacuum absorption. Whenthe wafer W is polished, the polishing liquid is supplied to thepolishing surface of the polishing pad 10 from the polishing-liquidsupply nozzle 32A, and the wafer W which is an object to be polished ispressed against the polishing surface by the top ring 31A and ispolished.

Next, a conveyance mechanism for conveying the wafer will be describedbelow. As is shown in FIG. 1, a first linear transporter 6 is arrangedso as to be adjacent to the first polishing unit 3A and the secondpolishing unit 3B. This first linear transporter 6 is a mechanism thatconveys the wafer among four conveyance positions (first conveyanceposition TP1, second conveyance position TP2, third conveyance positionTP3 and fourth conveyance position TP4, sequentially from side ofloading/unloading unit), which are provided along a direction in whichthe polishing units 3A and 3B are arrayed.

In addition, a second linear transporter 7 is arranged so as to beadjacent to the third polishing unit 3C and the fourth polishing unit3D. This second linear transporter 7 is a mechanism that conveys thewafer among three conveyance positions (fifth conveyance position TP5,sixth conveyance position TP6 and seventh conveyance position TP7,sequentially from side of loading/unloading unit), which are providedalong a direction in which the polishing units 3C and 3D are arrayed.

The wafer is conveyed to the polishing units 3A and 3B, by the firstlinear transporter 6. The top ring 31A of the first polishing unit 3A ismoved between the polishing position and the second conveyance positionTP2, by a swing operation of the head of the top ring. Accordingly, thewafer is delivered to the top ring 31A at the second conveyance positionTP2. Similarly, the top ring 31B of the second polishing unit 3B movesbetween the polishing position and the third conveyance position TP3,and the wafer is delivered to the top ring 31B at the third conveyanceposition TP3. The top ring 31C of the third polishing unit 3C movesbetween the polishing position and the sixth conveyance position TP6,and the wafer is delivered to the top ring 31C at the sixth conveyanceposition TP6. The top ring 31D of the fourth polishing unit 3D movesbetween the polishing position and the seventh conveyance position TP7,and the wafer is delivered to the top ring 31D at the seventh conveyanceposition TP7.

A lifter 11 for receiving the wafer from the conveying robot 22 isarranged in the first conveyance position TP1. The wafer is delivered tothe first linear transporter 6 from the conveying robot 22 through thislifter 11. A shutter (unillustrated) is provided in the partition wall 1a so as to be positioned between the lifter 11 and the conveying robot22, and is structured to be opened so that the wafer is delivered to thelifter 11 from the conveying robot 22, when the wafer is conveyed. Inaddition, a swing transporter 12 is arranged in a space surrounded bythe first linear transporter 6, the second linear transporter 7 and thecleaning unit 4. This swing transporter 12 has a hand which can movebetween the fourth conveyance position TP4 and the fifth conveyanceposition TP5, and the wafer is delivered to the second lineartransporter 7 from the first linear transporter 6, by the swingtransporter 12. The wafer is conveyed to the third polishing unit 3Cand/or fourth polishing unit 3D, by the second linear transporter 7. Inaddition, the wafer which has been polished in the polishing unit 3 isconveyed to the cleaning unit 4 through the swing transporter 12.

<Cleaning Unit>

FIG. 3A is a plan view showing the cleaning unit 4, and FIG. 3B is aside view showing the cleaning unit 4. As is shown in FIG. 3A and FIG.3B, the cleaning unit 4 is divided into a first cleaning chamber 190, afirst conveying chamber 191, a second cleaning chamber 192, a secondconveying chamber 193 and a drying chamber 194. In the first cleaningchamber 190, an upper primary cleaning module 201A and a lower primarycleaning module 201B are arranged which are arrayed in a verticaldirection. The upper primary cleaning module 201A is arranged above thelower primary cleaning module 201B. Similarly, in the second cleaningchamber 192, an upper secondary cleaning module 202A and a lowersecondary cleaning module 202B are arranged which are arrayed in thevertical direction. The upper secondary cleaning module 202A is arrangedabove the lower secondary cleaning module 202B. The primary andsecondary cleaning modules 201A, 201B, 202A and 202B are cleaningmachines which clean the wafer by using a cleaning liquid. These primaryand secondary cleaning modules 201A, 201B, 202A and 202B are arrayed ina vertical direction, and accordingly can obtain such an advantage thata footprint area is small.

A temporary placing table 203 of the wafer is provided in between theupper secondary cleaning module 202A and the lower secondary cleaningmodule 202B. In the drying chamber 194, an upper drying module 205A anda lower drying module 205B are arranged which are arrayed in thevertical direction. These upper drying module 205A and lower dryingmodule 205B are separated from each other. In the respective upper partsof the upper drying module 205A and the lower drying module 205B, filterfan units 207 and 207 are provided which supply clean air into thedrying modules 205A and 205B, respectively. The upper primary cleaningmodule 201A, the lower primary cleaning module 201B, the upper secondarycleaning module 202A, the lower secondary cleaning module 202B, thetemporary placing table 203, the upper drying module 205A and the lowerdrying module 205B are fixed to an unillustrated frame through a bolt orthe like.

In the first conveying chamber 191, a first conveying robot (conveyingmechanism) 209 is arranged which can vertically move, and in the secondconveying chamber 193, a second conveying robot 210 is arranged whichcan vertically move. The first conveying robot 209 and the secondconveying robot 210 are movably supported by support shafts 211 and 212,respectively, which extend in the vertical direction. The firstconveying robot 209 and the second conveying robot 210 have drivingmechanisms such as motors in the respective inner parts, and arestructured so as to be capable of moving vertically along the respectivesupport shafts 211 and 212. The first conveying robot 209 has two-tieredupper and lower hands, similarly to the conveying robot 22. The firstconveying robot 209 is arranged at such a position that the lower handthereof can access the above described temporary placing table 180, asis shown by a dotted line in FIG. 3(a). A shutter (unillustrated)provided in the partition wall 1 b is structured to be opened when thelower hand of the first conveying robot 209 accesses the temporaryplacing table 180.

The first conveying robot 209 operates so as to convey the wafer W amongthe temporary placing table 180, the upper primary cleaning module 201A,the lower primary cleaning module 201B, the temporary placing table 203,the upper secondary cleaning module 202A and the lower secondarycleaning module 202B. When conveying the wafer (wafer having slurrydeposited thereon) prior to cleaning, the first conveying robot 209 usesthe lower hand, and when conveying the wafer after cleaning, uses theupper hand. The second conveying robot 210 operates so as to convey thewafer W among the upper secondary cleaning module 202A, the lowersecondary cleaning module 202B, the temporary placing table 203, theupper drying module 205A and the lower drying module 205B. The secondconveying robot 210 is provided with only one hand, because of conveyingonly a cleaned wafer. The conveying robot 22 shown in FIG. 1 takes outthe wafer from the upper drying module 205A or the lower drying module205B by using the upper hand thereof, and returns the taken out wafer tothe wafer cassette. A shutter (unillustrated) provided in the partitionwall 1 a is structured to be opened when the upper hand of the conveyingrobot 22 accesses the drying modules 205A or 205B.

<Efficient Execution of Plurality of Functions of CMP Apparatus>

Next, an efficient execution of a plurality of functions of the CMPapparatus will be described below.

FIG. 4 is a view showing the configurations of the CMP apparatus and thecontrol device (operation for PC). As has been described above, the CMPapparatus includes a plurality of units such as the loading/unloadingunit 2, the polishing unit 3 and the cleaning unit 4. In addition, theloading/unloading unit 2 has a sequencer 260 for controlling theoperations of a plurality of components 250-1 to 250-m (conveying robot22 and the like) in the loading/unloading unit 2 provided therein. Inaddition, the polishing unit 3 has a sequencer 360 for controlling theoperations of a plurality of components 350-1 to 350-n (polishing table,top ring and the like) in the polishing unit 3 provided therein. Inaddition, the cleaning unit 4 has a sequencer 460 for controlling theoperations of a plurality of components 450-1 to 450-p (cleaning module,conveying robot and the like) in the cleaning unit 4 provided therein.

The control device 5 is connected to the loading/unloading unit 2(sequencer 260), the polishing unit 3 (sequencer 360), and the cleaningunit 4 (sequencer 460).

FIG. 5 is a view showing the configuration of the control device 5. Thecontrol device 5 is provided with a plurality of software applicationsfor executing each function of treatments concerning the CMP apparatus.Specifically, the control device 5 is provided with an interface-relatedAPSW (software application) 510, a control-related APSW 520 and a taskmonitoring APSW 530.

In addition, the control device 5 is provided with a shared memory 540,a display device 550 and a communication driver 560. The shared memory540 is a storage device which is shared by the interface-related APSW510, the control-related APSW 520 and the task monitoring APSW 530. Thedisplay device 550 is an interface to a user. The communication driver560 is a driver for communicating between each of the interface-relatedAPSW 510 and the control-related APSW 520, and each of the sequencers260, 360 and 460.

The interface-related APSW 510 is a software application for executingprocesses of inputting and outputting information through the displaydevice 550.

The control-related APSW 520 is a software application for executing aprocess of operating the CMP apparatus on the basis of the inputinformation which has been input by the interface-related APSW 510, or aprocess of storing the input information into the shared memory 540.

In addition, the task monitoring APSW 530 is a software applicationwhich monitors whether abnormality has occurred in the plurality ofsoftware applications (interface-related APSW 510 and control-relatedAPSW 520), or not. The task monitoring APSW 530 restarts the softwareapplication in which the abnormality has occurred, when the abnormalityhas occurred in any of the plurality of software applications, and makesthe other software applications continue the respective processes.

When the recipe edition through the display device 550 is executed bythe interface-related APSW 510, and simultaneously, the single-body testof the polishing unit 3 is executed by the control-related APSW 520, forinstance, suppose that the abnormality has occurred in theinterface-related APSW 510. In this case, the task monitoring APSW 530restarts the interface-related APSW 510, and also makes thecontrol-related APSW 520 continue the processing. In other words, thetask monitoring APSW 530 does not restart all of the softwareapplications, but restarts only the interface-related APSW 510.

Thereby, the single-body test of the polishing unit 3 is continued bythe control-related APSW 520. As has been described above, in thepresent embodiment, the interface-related APSW 510 and thecontrol-related APSW 520 are installed as separate softwareapplications. Thereby, when abnormality has occurred in any one of thesoftware applications, the processing of the software application inwhich abnormality does not occur can be continued. As a result,according to the present embodiment, the plurality of functions of theCMP apparatus can be efficiently executed.

<Interface-Related APSW>

Next, the details of the interface-related APSW 510 will be describedbelow. The interface-related APSW 510 is provided with a recipe-editingAPSW 512, an APSW 514 for creating jobs for automatic conveyance, anAPSW 516 for operating a single body of a unit, and a parameter-editingAPSW 518.

The recipe-editing APSW 512 is a software application for editingrecipes concerning the substrate treatment of the CMP apparatus. TheAPSW 514 for creating jobs for automatic conveyance is a softwareapplication for editing jobs (JOBs) of the CMP apparatus, which arecreated by combining the recipes to each other.

The APSW 516 for operating a single body of a unit is a softwareapplication for inputting a command for a test or adjustment of the unit(loading/unloading unit 2, polishing unit 3 or cleaning unit 4) includedin the CMP apparatus, into the corresponding unit. The parameter-editingAPSW 518 is a software application for editing parameters which are usedin the CMP apparatus.

Incidentally, the software applications included in theinterface-related APSW 510 are not limited to the software applicationsshown in FIG. 5. For instance, a software application for displaying animage obtained by monitoring a predetermined portion of the CMPapparatus on the display device 550, and the like, can also be provided.In addition, a software application for displaying various historicaldata concerning the CMP apparatus on the display device 550, and thelike, can also be provided.

Here, one example of the screen will be described below which isdisplayed on the display device 550 by the interface-related APSW 510.FIGS. 6A, 6B and 6C are views each showing one example of a screen whichis displayed on the display device 550 by the interface-related APSW510. FIG. 6A is a view showing one example of the screen which isdisplayed when the task monitoring APSW 530 has been started. As isshown in FIG. 6A, the display device 550 displays a title display region610, a submenu display region 620, a main menu display region 630 and aninterface-related APSW display region 640 thereon.

A plurality of submenu buttons 650 concerning the task monitoring APSWare displayed in the submenu display region 620. In addition, aplurality of main menu buttons 660 concerning the interface-related APSW510 are displayed in the main menu display region 630.

As is shown in FIG. 6B, when one (for instance, recipe-editing APSW 512)of the plurality of main menu buttons 660 has been clicked, forinstance, a screen for editing recipes is displayed on theinterface-related APSW display region 640.

In addition, as is shown in FIG. 6C, when one (for instance, APSW 514for creating jobs for automatic conveyance) of the plurality of mainmenu buttons 660 has been clicked, for instance, a screen for editingjobs is displayed on the interface-related APSW display region 640.

When abnormality has occurred in any of the recipe-editing APSW 512, theAPSW 514 for creating jobs for automatic conveyance, the APSW 516 foroperating a single body of a unit and the parameter-editing APSW 518,the task monitoring APSW 530 restarts the software application in whichthe abnormality has occurred, and makes the other software applicationscontinue the respective processes.

When the APSW 514 for creating jobs for automatic conveyance executesthe edition of the jobs while the recipe-editing APSW 512 executes theedition of the recipes, for instance, suppose that abnormality hasoccurred in the recipe-editing APSW 512. In this case, the taskmonitoring APSW 530 restarts the recipe-editing APSW 512, and also makesthe APSW 514 for creating jobs for automatic conveyance continue theprocessing. In other words, the task monitoring APSW 530 does notrestart all of the software applications, but restarts only therecipe-editing APSW 512.

Thereby, the edition of the jobs by the APSW 514 for creating jobs forautomatic conveyance is continued. As has been described above, in thepresent embodiment, the recipe-editing APSW 512, the APSW 514 forcreating jobs for automatic conveyance, the APSW 516 for operating asingle body of a unit and the parameter-editing APSW 518 are installedas separate software applications. Thereby, when the abnormality hasoccurred in any of the software applications, the processing of thesoftware application in which the abnormality does not occur can becontinued. As a result, according to the present embodiment, theplurality of functions of the CMP apparatus can be efficiently executed.

Incidentally, in the present embodiment, an example has been describedin which the interface-related APSW 510 includes four softwareapplications, but the present embodiment is not limited to the example.The interface-related APSW 510 may include at least two out of the foursoftware applications. In this case, when abnormality has occurred inany of at least two out of the recipe-editing APSW 512, the APSW 514 forcreating jobs for automatic conveyance, the APSW 516 for operating asingle body of a unit and the parameter-editing APSW 518, the taskmonitoring APSW 530 restarts the software application in which theabnormality has occurred, and can make the other software applicationscontinue the processing.

<Control-Related APSW>

Next, the details of the control-related APSW 520 will be describedbelow. The control-related APSW 520 is provided with a recipe managementAPSW 522, a job management/control APSW 524, an APSW 526 for operating asingle body of a unit, and a parameter management APSW 528.

The recipe management APSW 522 is a software application for storing therecipes which have been edited through the recipe-editing APSW 512, intoa shared memory 540. The job management/control APSW 524 is a softwareapplication for storing the jobs which have been edited through the APSW514 for creating jobs for automatic conveyance, into the shared memory540, and also making the CMP apparatus operate on the basis of the jobs.

The APSW 526 for operating a single body of a unit is a softwareapplication for operating the unit included in the CMP apparatus on thebasis of a command which has been input through the APSW 516 foroperating a single body of a unit. The parameter management APSW 528 isa software application for storing the parameters which have been editedthrough the parameter-editing APSW 518, into the shared memory 540.

Incidentally, the software applications included in the control-relatedAPSW 520 are not limited to the software applications shown in FIG. 5.For instance, a software application for collecting various historicaldata concerning the CMP apparatus and storing the collected data intothe shared memory 540 can also be provided.

When abnormality has occurred in any of the recipe management APSW 522,the job management/control APSW 524, the APSW 526 for operating a singlebody of a unit and the parameter management APSW 528, the taskmonitoring APSW 530 restarts the software application in which theabnormality has occurred, and makes the other software applicationscontinue the respective processes.

When the APSW 526 for operating a single body of a unit executes thesingle-body test of the unit included in the CMP apparatus while therecipe management APSW 522 executes the storage of recipes into theshared memory 540, for instance, suppose that the abnormality hasoccurred in recipe management APSW 522. In this case, the taskmonitoring APSW 530 restarts the recipe management APSW 522, and alsomakes the APSW 526 for operating a single body of a unit continue theprocesses. In other words, the task monitoring APSW 530 does not restartall of the software applications, but restarts only the recipemanagement APSW 522.

Thereby, the single-body test of a unit by the APSW 526 for operating asingle body of a unit is continued. As has been described above, in thepresent embodiment, the recipe management APSW 522, the jobmanagement/control APSW 524, the APSW 526 for operating a single body ofa unit and the parameter management APSW 528 are installed as separatesoftware applications. Thereby, when the abnormality has occurred in anyof the software applications, the processing of the software applicationin which the abnormality does not occur can be continued. As a result,according to the present embodiment, the plurality of functions of theCMP apparatus can be efficiently executed.

Incidentally, in the present embodiment, an example has been describedin which the control-related APSW 520 includes four softwareapplications, but the present embodiment is not limited to the example.The control-related APSW 520 may include at least two out of the foursoftware applications. In this case, when abnormality has occurred inany of at least two out of the recipe management APSW 522, the jobmanagement/control APSW 524, the APSW 526 for operating a single body ofa unit and the parameter management APSW 528, the task monitoring APSW530 can restart the software application in which the abnormality hasoccurred, and make the other software applications continue theprocessing.

<Control Flow>

Next, a flow of processing by the control device 5 will be describedbelow. FIG. 7 is a view showing the flow of the processing by thecontrol device 5.

As is shown in FIG. 7, when the task monitoring APSW 530 has beenstarted, the task monitoring APSW 530 monitors the state of a pluralityof software applications which have been started (step S101).Specifically, the task monitoring APSW 530 determines whether thereexists a software application which has been abnormally finished, or not(step S102).

When having determined that there exists no software application whichhas been abnormally finished (No, in step S102), the task monitoringAPSW 530 determines whether there exists a software application which ishung up (which causes abnormality), or not (step S103).

When having determined that there exists no software application whichis hung up (which causes abnormality), (No, in step S103), the taskmonitoring APSW 530 returns to the processing of the step S101.

On the other hand, when having determined that there exists a softwareapplication which is hung up (which causes abnormality), (Yes, in stepS103), the task monitoring APSW 530 forcibly finishes the softwareapplication (abnormal software application) which is hung up (stepS104).

Subsequently, the task monitoring APSW 530 starts (restarts) thesoftware application which has been forcibly finished (step S105).

On the other hand, when having determined that there exists the softwareapplication which has been abnormally finished in the step S102 (Yes, instep S102), the task monitoring APSW 530 starts (restarts) the softwareapplication which has been abnormally finished (step S105). The taskmonitoring APSW 530 returns to the processing of the step S101 after theprocessing of the step S105.

The task monitoring APSW 530 repeats the processes of the step S101 tothe step S105 until the task monitoring APSW 530 is finished.

As has been described above, in the present embodiment, the softwareapplications are separately installed for each function of the CMPapparatus, for instance, like the interface-related APSW 510 and thecontrol-related APSW 520. Thereby, when abnormality has occurred in anyof the software applications, the processing of the software applicationin which abnormality does not occur can be continued. As a result,according to the present embodiment, the plurality of functions of theCMP apparatus can be efficiently executed.

Furthermore, in the present embodiment, the software applications areseparately installed for each of the functions also in theinterface-related APSW 510, like the recipe-editing APSW 512, the APSW514 for creating jobs for automatic conveyance, APSW 516 for operatingthe single body of a unit, and the parameter-editing APSW 518. Thereby,when abnormality has occurred in any of the software applications, theprocessing of the software application in which abnormality does notoccur can be continued. As a result, according to the presentembodiment, the plurality of functions of the CMP apparatus can beefficiently executed.

In addition, in the present embodiment, the software applications areseparately mounted for each of the functions also in the control-relatedAPSW 520, like the recipe management APSW 522, the jobmanagement/control APSW 524, the APSW 526 for operating the single bodyof a unit, and the parameter management APSW 528. Thereby, whenabnormality has occurred in any one of the software applications, theprocessing of the software application in which abnormality does notoccur can be continued. As a result, according to the presentembodiment, the plurality of functions of the CMP apparatus can beefficiently executed.

<Enhancement of Usability of User Interface>

Next, the enhancement of the usability of a user interface of the CMPapparatus will be described below.

FIG. 8 is a view showing configurations of the display control deviceand the CMP apparatus. As has been described above, the CMP apparatusincludes the plurality of units such as the loading/unloading unit 2,the polishing unit 3 and the cleaning unit 4.

The loading/unloading unit 2 has a sequencer 1260 for controlling theoperation of a plurality of components 1250-1 to 1250-m (conveying robot22 and the like) in the loading/unloading unit 2 provided therein. Inaddition, the loading/unloading unit 2 has a plurality of sensors 1270-1to 1270-a which detect data concerning the control of theloading/unloading unit 2 provided therein. The sensors 1270-1 to 1270-ainclude, for instance, a sensor which detects whether the wafer has beenset on the conveying robot 22 or not.

The polishing unit 3 has a sequencer 1360 for controlling the operationsof a plurality of components 1350-1 to 1350-n (polishing table, top ringand the like) in the polishing unit 3 provided therein. In addition, thepolishing unit 3 has a plurality of sensors 1370-1 to 1370-b whichdetect data concerning the control of the polishing unit 3 providedtherein. The sensors 1370-1 to 1370-b include, for instance, a sensorwhich detects a flow rate of a polishing liquid that is supplied to thepolishing pad 10, a sensor which detects the number of revolutions ofthe polishing table 30, and a sensor which detects a running torque ofthe polishing table 30 or the top ring 31.

The cleaning unit 4 has a sequencer 1460 for controlling the operationsof a plurality of components 1450-1 to 1450-p (cleaning module,conveying robot and the like) in the cleaning unit 4 provided therein.In addition, the cleaning unit 4 has a plurality of sensors 1470-1 to1470-c which detect data concerning the control of the cleaning unit 4provided therein. The sensors 1470-1 to 1470-c include, for instance, asensor which detects a flow rate of a cleaning liquid that is suppliedto the wafer.

The control device 5 is connected to the loading/unloading unit 2(sequencer 1260), the polishing unit 3 (sequencer 1360) and the cleaningunit 4 (sequencer 1460). The control device 5 is provided with an inputoperation unit 1512, a storage unit 1514, a display unit 1516 and adisplay control device 1520.

The input operation unit 1512 is an input interface (for instance, mouseor the like) through which a user executes various operations such asthe edition of the recipes concerning the CMP apparatus. The storageunit 1514 is a storage medium for storing various information such asthe sizes and the arrangement positions of a plurality of images thereinthat are to be displayed on the display unit 1516. The display unit 1516is a user interface through which various data are displayed and also auser performs various operations of the CMP apparatus.

The display control device 1520 is provided with a receiving unit 1522,a storage control unit 1524 and a display control unit 1526.

The receiving unit 1522 receives a start-up command of the softwareconcerning the operation of the CMP apparatus. For instance, when theuser has performed an operation of starting the software through theinput operation unit 1512, the receiving unit 1522 receives the start-upcommand which has been generated by this start-up operation.

The display control unit 1526 reads out images from the storage unit1514, which correspond to the start-up command that has been received bythe receiving unit 1522, and makes the display unit 5116 display theread out images. Specifically, the image which is displayed on thedisplay unit 1516 includes a plurality of images of different functions(for instance, monitoring-related image and operation-related image). Inthis case, the display control unit 1526 reads out the sizes and thearrangement positions of the images for each of the plurality of images,from the storage unit 1514, and makes the display unit 1516 display eachof the images on the basis of the size and arrangement position of eachof the read out images. Incidentally, in the present embodiment, anexample will be shown below in which the sizes or positions of theimages concerning the monitoring-related image and the operation-relatedimage are adjusted, but the present invention is not limited to theexample.

In addition, the display control unit 1526 can adjust the sizes orarrangement positions of the plurality of images which have beendisplayed on the display unit 1516, on the basis of an adjustmentinstruction that has been input through the input operation unit 1512.When the input operation unit 1512 is a mouse, for instance, after theuser has performed an operation of expanding the sizes of the imageswhich have been displayed on the display unit 1516, by a Drag & Dropoperation of the mouse, the display control unit 1526 makes the displayunit 1516 display the images in the state of having made the sizes ofthe images expanded according to an expansion instruction that has beeninput through the mouse. In addition, for instance, when the user hasperformed an operation of changing the arrangement positions of theimages which have been displayed on the display unit 1516, by the Drag &Drop operation of the mouse, the display control unit 1526 changescoordinates of the images according to a change instruction which hasbeen input through the mouse, and makes the display unit 1516 displaythe images on the basis of the changed coordinates.

The storage control unit 1524 can make the storage unit 1514 store thesizes and the arrangement positions of the plurality of images whichhave been displayed on the display unit 1516, while making the sizes andthe arrangement positions correspond to the type of the start-up commandwhich has made the display unit 1516 display the plurality of images.Specifically, it needs a labor to adjust the plurality of images to theoptimum sizes and arrangement positions, every time when a user startsthe software application, and accordingly when the sizes and thearrangement positions have been adjusted once, the storage control unit1524 can make the storage unit 1514 store the state.

In this case, when the receiving unit 1522 has received the start-upcommand, the display control unit 1526 reads out the sizes and thearrangement positions of the plurality of images from the storage unit,which correspond to the type of the start-up command that has beenreceived by the receiving unit 1522. The display control unit 1526 makesthe display unit 1516 display the plurality of images, on the basis ofthe read out sizes and arrangement positions of the plurality of images.Thereby, when the user has started the software application, theplurality of images are displayed in the state of the optimum size andarrangement position which have been stored with regard to the softwareapplication. Accordingly, it is unnecessary to adjust the sizes andarrangement positions of the plurality of images again, and theusability is excellent.

In addition, the storage control unit 1524 can make the storage unit1514 store the sizes and arrangement positions of the plurality ofimages which have been displayed on the display unit 1516, while makingthe sizes and arrangement positions correspond to the type of thestart-up command that has made the display unit 1516 display theplurality of images, and to an identifier that has been input throughthe input operation unit 1512. In other words, there is the case wherethe optimum size and arrangement position of the plurality of images aredifferent depending on each user. Then, by making the storage unit 1514store the sizes and arrangement positions of the plurality of imageswhile making the sizes and arrangement positions correspond to theidentifier (for instance, user name or the like) which the user hasinput, the storage control unit 1524 can make the storage unit 1514store the optimum size and arrangement position of the images for eachof the individual users.

In this case, when the receiving unit 1522 has received the start-upcommand, the display control unit 1526 reads out the sizes and thearrangement positions of the plurality of images from the storage unit1514, which correspond to the type of the start-up command that has beenreceived by the receiving unit 1522 and the identifier that has beeninput through the input operation unit 1512. Then, the display controlunit 1526 can make the display unit 1516 display a plurality of images,on the basis of the read out sizes and arrangement positions of theplurality of images. Thereby, if the user has input the identifier (forinstance, user name or the like) when starting the software application,the plurality of images are displayed in the state of the size andarrangement position which have been stored according to the identifier,and accordingly it is unnecessary to adjust again the optimum size andarrangement state of the images, which is specific to the user. Thus,the usability is excellent.

<Example of Adjustment of Image>

Adjustment of a plurality of images by the display control unit 1526will be described below with reference to the drawings. FIG. 9 is a viewshowing one example of an image display according to a conventionaltechnology. FIG. 10 to FIG. 11 are views showing one example of an imagedisplay which has been adjusted by the present embodiment.

As is shown in FIG. 9, in a conventional technology, a title displayimage 1602 is displayed on the upper part of the screen of the displayunit 1516, an operation menu image 1604 is displayed on the left partthereof, and a main menu image 1606 is displayed on the lower partthereof. The title display image 1602, the operation menu image 1604 andthe main menu image 1606 constitute a base image 1608 which is used incommon regardless of the type of the software that is executed for theCMP apparatus. The title display image 1602 has a button 1661 foroperation for performing various operations concerning the CMP apparatusprovided therein. The operation menu image 1604 has buttons 1662, 1663and 1664 for operation for performing various operations concerning theCMP apparatus provided therein. The main menu image 1606 has buttons1665, 1666 and 1667 for operation for performing various operationsconcerning the CMP apparatus provided therein.

In a region 1610 which excludes the title display image 1602, theoperation menu image 1604 and the main menu image 1606 from the screenson the display unit 1516, a monitoring-related image 1620 andoperation-related images 1630, 1640 and 1650 are displayed.

Specifically, the monitoring-related image 1620 is displayed on aleft-side half region of the region 1610, as an image 1. Themonitoring-related image 1620 is, for instance, an image for a user tomonitor an operation state of the CMP apparatus. In addition, theoperation-related images 1630, 1640 and 1650 are displayed on aright-side half region of the region 1610 as an image 2, an image 3 andan image 4, respectively. The operation-related image 1630 is, forinstance, an image for a user to perform an operation concerning thesubstrate. In addition, the operation-related image 1640 is an image fora user to perform an operation concerning a carrier of the substrate. Inaddition, the operation-related image 1650 is an image for a user toperform an operation concerning a job.

In the CMP apparatus, there are various operation states such as anexecution of a process in each unit, an automatic conveyance test forthe substrate, an assembly of the substrate treatment apparatus and thelike, and software applications are installed for each of theoperations. On the other hand, in the conventional technology, even whenany one of the software applications has been executed, themonitoring-related image 1620 has been displayed in the left-side halfregion of the region 1610, and the operation-related images 1630, 1640and 1650 have been displayed in the right-side half region of the region1610, as are shown in FIG. 9.

On the other hand, in the present embodiment, the display control unit1526 can adjust the sizes or arrangement positions of the plurality ofimages which are displayed on the display unit 1516. For instance, astate shall be considered in which the user performs mainly an operationconcerning the job while monitoring the operation state of the CMPapparatus (does not perform operation concerning substrate or operationconcerning carrier of substrate). In this case, the display control unit1526 can expand the operation-related image 1650 of the image 4 to thewhole right-side half region of the region 1610, on the basis of theadjustment instruction by the user, as is shown in FIG. 10.

On the other hand, a state shall be considered in which the usermonitors the operation state of the CMP apparatus, but the importance isnot so high, and the user performs mainly the operation concerning thesubstrate, the operation concerning the carrier of the substrate, andthe operation concerning the job. In this case, the display control unit1526 can reduce the size of the monitoring-related image 1620 of theimage 1 and also change the arrangement position of theoperation-related image 1630 to an unoccupied left-side half region ofthe region 1610, on the basis of the adjustment instruction by the user,as is shown in FIG. 11. In addition, the display control unit 1526 canexpand the operation-related image 1650 in the right-side half region ofthe region 1610, move the arrangement position upward, and move thearrangement position of the operation-related image 1640 to a lowerregion which has become empty due to the movement of theoperation-related image 1650, on the basis of the adjustment instructionby the user.

As has been described above, according to the present embodiment, a usercan adjust the optimum size and arrangement position of the image whilematching the size and arrangement position to the type (operationstates) of the software application which is executed by the CMPapparatus, and accordingly the usability concerning the user interfaceof the CMP apparatus can be enhanced.

Incidentally, as is shown in FIG. 9 to FIG. 11, the base image 1608which is used in common regardless of the type of start-up command ofthe software application is included in the plurality of images that aredisplayed on the display unit 1516. The display control unit 1526 canmake the display unit 1516 display the base image 1608 with a fixed sizeand at a fixed arrangement position, regardless of the type of thestart-up command which has been received by the receiving unit 1522. Thereason is because the base image 1608 is an image for performing theoperation of the CMP apparatus and the like regardless of the type ofsoftware application, and accordingly there is the case where theusability of the user interface is rather excellent when the size andthe arrangement position are not changed but fixed.

<Specific Example of Adjustment of Image>

Next, a specific example of the size and the arrangement position of theimage according to the type (operation state) of the software which isexecuted by the CMP apparatus will be described below. FIG. 12 is a viewshowing one example of an image display shown when an assembly andadjustment of the CMP apparatus is executed.

When the assembly and adjustment of the CMP apparatus is executed, errorinformation concerning the assembly and adjustment is monitored and alsoa plurality of operations are performed; but the importance of themonitoring is not so high, and the importance of the operation-relatedimage is high as compared with the importance of the monitoring, becausethe plurality of operations are performed.

For this reason, the display control unit 1526 can adjust the size ofthe monitoring-related image 1620 which displays the error information,and arrange the adjusted image to the left-side lower part of the region1610, on the basis of the adjustment instruction of the user, as isshown in FIG. 12. In addition, the display control unit 1526 can adjustthe size of the operation-related image 1630 for operating each of theunits, and arrange the adjusted image to the left-side upper part of theregion 1610, on the basis of the adjustment instruction of the user. Inaddition, the display control unit 1526 can adjust the size of theoperation-related image 1640 for editing a manual parameter concerningthe assembly and adjustment, and arrange the adjusted image to theright-side upper part of the region 1610, on the basis of the adjustmentinstruction of the user. In addition, the display control unit 1526 canadjust the size of the operation-related image 1650 for editing a systemparameter concerning the assembly and adjustment, and arrange theadjusted image to the right-side upper part of the region 1610, on thebasis of the adjustment instruction of the user.

Next, FIG. 13 is a view showing one example of an image display shownwhen the process treatment in a unit of the CMP apparatus is executed.When the process treatment is executed, various information concerningthe process treatment is monitored while the recipe is edited, but theimportance of the edition of the recipe is not so high, and theimportance of the monitoring of various information concerning theprocess treatment is high as compared with the importance of theedition.

For this reason, the display control unit 1526 can adjust the size ofthe operation-related image 1630 for editing the recipe, and arrange theadjusted image to the left-side upper part of the region 1610, on thebasis of the adjustment instruction of the user, as is shown in FIG. 13.In addition, the display control unit 1526 can adjust the size of themonitoring-related image 1620 for monitoring the conveying state of thesubstrate, and arrange the adjusted image to the left-side lower part ofthe region 1610, on the basis of the adjustment instruction of the user.In addition, the display control unit 1526 can adjust the size of themonitoring-related image 1620 for monitoring the result of the processtreatment, and can arrange the adjusted image to the right-side upperpart of the region 1610, on the basis of the adjustment instruction ofthe user. In addition, the display control unit 1526 can adjust the sizeof the monitoring-related image 1620 for monitoring the state of aconsumable member, and arrange the adjusted image to the right-sidelower part of the region 1610, on the basis of the adjustmentinstruction of the user.

Next, FIG. 14 is a view showing one example of an image display shownwhen an automatic conveyance test of a substrate is executed in the CMPapparatus. When the automatic conveyance test of the substrate isexecuted, a loading port is operated and also various informationconcerning the automatic conveyance of the substrate is monitored, butthe importance of the operation of the loading port is not so high, andthe importance of the monitoring of various information concerning theautomatic conveyance of the substrate is high as compared with theimportance of the operation of the loading port.

For this reason, the display control unit 1526 can adjust the size ofthe monitoring-related image 1620 for monitoring a conveyance situationof the substrate, and arrange the adjusted image to the left-side upperpart of the region 1610, on the basis of the adjustment instruction ofthe user, as is shown in FIG. 14. In addition, the display control unit1526 can adjust the size of the monitoring-related image 1620 formonitoring error information concerning the automatic conveyance of thesubstrate, and arrange the adjusted image to the left-side lower part ofthe region 1610, on the basis of the adjustment instruction of the user.In addition, the display control unit 1526 can adjust the size of theoperation-related image 1630 for operating the loading port, and arrangethe adjusted image to the right-side upper part of the region 1610, onthe basis of the adjustment instruction of the user. In addition, thedisplay control unit 1526 can adjust the size of the monitoring-relatedimage 1620 for monitoring information concerning a job operation of theautomatic conveyance of the substrate, and arrange the adjusted image tothe right-side lower part of the region 1610, on the basis of theadjustment instruction of the user.

Next, FIG. 15 is a view showing one example of the image display shownwhen a trouble has occurred during the process treatment in the CMPapparatus. When the trouble has occurred during the process treatment,the system parameter is edited and also the result of the processtreatment and the error information are monitored, but the importance ofthe operation of editing the system parameter is not so high, and theimportance of the monitoring of the process treatment and the errorinformation is high as compared with the importance of the operation ofediting the system parameter.

For this reason, the display control unit 1526 can adjust the size ofthe monitoring-related image 1620 for monitoring the result of theprocess treatment, and arrange the adjusted image to the left side ofthe region 1610, on the basis of the adjustment instruction of the user,as is shown in FIG. 15. In addition, the display control unit 1526 canadjust the size of the monitoring-related image 1620 for monitoring theerror information, and arrange the adjusted image to the right-sideupper part of the region 1610, on the basis of the adjustmentinstruction of the user. In addition, the display control unit 1526 canadjust the size of the operation-related image 1630 for operating thesystem parameter, and arrange the adjusted image to the right-side lowerpart of the region 1610, on the basis of the adjustment instruction ofthe user.

<Flow Chart>

Next, a process which is executed by the display control device 1520will be described below. FIG. 16 and FIG. 17 are flow charts of theprocesses which are executed by the display control device 1520. FIG. 16and FIG. 17 are examples in which the plurality of images are adjusted,and also an identifier which is specific to the user is used in orderthat the optimum image arrangement for each of the users is reproducedwith excellent usability. FIG. 16 assumes the case where the pluralityof images are not yet adjusted, and default values of the sizes and thearrangement positions of the plurality of images are stored in thestorage unit 1514.

As is shown in FIG. 16, firstly, the receiving unit 1522 receives thestart-up command of a software application (step S1101). The start-upcommand of the software application is generated, for instance, by anoperation of starting the software application, which is performed bythe user through the input operation unit 1512.

Subsequently, the display control unit 1526 reads out the default valuesof the sizes and the arrangement positions of the plurality of imagesfrom the storage unit 1514, which correspond to the start-up commandthat has been received by the receiving unit 1522 (step S1102).Subsequently, the display control unit 1526 makes the display unit 1516display the plurality of images, on the basis of the default values ofthe sizes and the arrangement positions of the read out images (stepS1103).

Subsequently, the display control unit 1526 adjusts the sizes and thearrangement positions of the plurality of images, on the basis of theadjustment instruction of the user, which has been input through theinput operation unit 1512 (step S1104).

Subsequently, when a storage instruction and a storage name of theimages have been input through the input operation unit 1512, thestorage control unit 1524 assigns the input storage name and stores thesizes and the arrangement positions of the plurality of images into thestorage unit 1514 (step S1105).

By the above described processing, the sizes and the arrangementpositions of the plurality of images are adjusted, and also the state isassociated with the storage name and is stored in the storage unit 1514.

Next, FIG. 17 assumes the case in which the software application hasbeen started in the state in which the plurality of images have beenadjusted, and the sizes and the arrangement positions of the adjustedimages have been stored in the storage unit 1514.

As is shown in FIG. 17, firstly, the receiving unit 1522 receives thestart-up command of a software application (step S1201). The start-upcommand of the software application is generated by an operation ofstarting the software application, which is performed by the userthrough the input operation unit 1512, for instance.

Subsequently, the input operation unit 1512 receives the storage nameinput by the user (step S1202). Subsequently, the display control unit1526 reads out the sizes and the arrangement positions of the pluralityof images from the storage unit 1514, which correspond to the start-upcommand that has been received by the receiving unit 1522 and thestorage name that has been received by the input operation unit 1512(step S1203).

Subsequently, the display control unit 1526 makes the display unit 1516display the plurality of images, on the basis of the sizes andarrangement positions of the read out images (step S1204).

According to the above processing, if the user has input the identifier(for instance, user name or the like) when starting the softwareapplication, the plurality of images are displayed in the state of thesize and arrangement position which have been stored according to theidentifier, and accordingly it is unnecessary to adjust again theoptimum size and arrangement state of the images, which is specific tothe user. Thus, the usability is excellent.

Next, another example of a process which is executed by the displaycontrol device 1520 will be described below. FIG. 18 and FIG. 19 areflow charts of the processes which are executed by the display controldevice 1520. FIG. 18 and FIG. 19 are examples in which the plurality ofimages are adjusted, and also the optimum image arrangement for each ofthe applications is reproduced with excellent usability. FIG. 18 assumesthe case in which the plurality of images are not yet adjusted, and thedefault values of the sizes and the arrangement positions of theplurality of images are stored in the storage unit 1514.

As is shown in FIG. 18, firstly, the receiving unit 1522 receives thestart-up command of a software application (step S1301). The start-upcommand of the software application is generated, for instance, by anoperation of starting the software application, which is performed bythe user through the input operation unit 1512.

Subsequently, the display control unit 1526 reads out the default valuesof the sizes and the arrangement positions of the plurality of imagesfrom the storage unit 1514, which correspond to the start-up commandthat has been received by the receiving unit 1522 (step S1302).Subsequently, the display control unit 1526 makes the display unit 1516display the plurality of images, on the basis of the default values ofthe sizes and the arrangement positions of the read out images (stepS1303).

Subsequently, the display control unit 1526 adjusts the sizes and thearrangement positions of the plurality of images, on the basis of theadjustment instruction of the user, which has been input through theinput operation unit 1512 (step S1304).

Subsequently, when a storage instruction of the images has been inputthrough the input operation unit 1512, the storage control unit 1524stores the sizes and the arrangement positions of the plurality ofimages into the storage unit 1514, while making the sizes and thearrangement positions correspond to the type of the software application(start-up command) that is currently started (step S1305).

By the above described processing, the sizes and the arrangementpositions of the plurality of images are adjusted, and also the state isassociated with the type of software application (start-up command) andis stored in the storage unit 1514.

Next, FIG. 19 assumes the case in which the software application hasbeen started in the state in which the plurality of images have beenadjusted, and the sizes and the arrangement positions of the adjustedimages have been stored in the storage unit 1514.

As is shown in FIG. 19, firstly, the receiving unit 1522 receives thestart-up command of a software application (step S1401). The start-upcommand of the software application is generated, for instance, by anoperation of starting the software application, which is performed bythe user through the input operation unit 1512.

Subsequently, the display control unit 1526 reads out the sizes and thearrangement positions of the plurality of images from the storage unit1514, which correspond to the type of the start-up command that has beenreceived by the receiving unit 1522 (step S1402).

Subsequently, the display control unit 1526 makes the display unit 1516display the plurality of images, on the basis of the sizes andarrangement positions of the read out images (step S1403).

According to the above processing, when the user has started thesoftware application, the plurality of images are displayed in the stateof the optimum size and arrangement position which have been stored withregard to the software application. Accordingly, it is unnecessary toadjust the sizes and arrangement positions of the plurality of imagesagain, and the usability is excellent.

<Efficient Execution of Plurality of Jobs Concerning Test Conveyance ofSubstrate>

Next, an efficient execution of a plurality of jobs concerning a testconveyance of a substrate will be described below.

FIG. 20 is a view showing configurations of the CMP apparatus and thecontrol device (PC for operation). As has been described above, the CMPapparatus includes a plurality of units such as the loading/unloadingunit 2, the polishing unit 3 and the cleaning unit 4. Theloading/unloading unit 2 has a sequencer 2260 for controlling theoperations of a plurality of components 2250-1 to 2250-m (conveyingrobot 22 and the like) in the loading/unloading unit 2 provided therein.The plurality of components 2250-1 to 2250-m include, for instance, aloading port which functions as an interface for supplying a wafer tothe CMP apparatus.

In addition, the polishing unit 3 has a sequencer 2360 for controllingthe operations of a plurality of components 2350-1 to 2350-n (polishingtable, top ring and the like) in the polishing unit 3 provided therein.In addition, the cleaning unit 4 has a sequencer 2460 for controllingthe operations of a plurality of components 2450-1 to 2450-p (cleaningmodule, conveying robot and the like) in the cleaning unit 4 providedtherein.

The control device 5 is connected to the loading/unloading unit 2(sequencer 2260), the polishing unit 3 (sequencer 2360) and the cleaningunit 4 (sequencer 2460). The control device 5 performs controlconcerning the test conveyance of the wafer.

As is shown in FIG. 20, in the state shown before the test conveyance ofthe wafer is started, for instance, a carrier 2500 is provided at apredetermined place which is distant from the CMP apparatus, andaccommodates wafers W for test conveyance therein. The carrier 2500 canaccommodate one wafer or a plurality of wafers therein. The CMPapparatus includes the carrier 2500, the treatment chambers of thepolishing unit 3, the cleaning unit 4 and the like, and the controldevice 5. Incidentally, the carrier 2500 approaches the treatmentchamber (polishing unit 3 or cleaning unit 4) of the wafer by theloading treatment, and moves away from the treatment chamber by theunloading treatment, in the process of the conveyance test of the wafer.

The control device 5 continuously executes a plurality of jobsconcerning the test conveyance in the treatment chamber (polishing unit3 or cleaning unit 4) of the wafer. Incidentally, the job specifies, forinstance, various parameters (for instance, conveyance path, conveyancespeed or the like) for subjecting the wafer to the test conveyance inthe treatment chamber, and arbitrary jobs can be created, for instance,by appropriately combining recipes which have been previously set forthe CMP apparatus, to each other. In addition, the plurality of createdjobs can be stored, for instance, in the storage device and the likewhich are provided in the control device 5.

In the present embodiment, the control device 5 continuously executesthe plurality of jobs not through the unloading treatment of moving thecarrier 2500 away from the treatment chamber, and not through theloading treatment of approaching the carrier 2500 to the treatmentchamber, between the plurality of jobs.

For instance, the control device 5 can determine whether the carrier2500 is subjected to the loading treatment or not, before the first jobout of the plurality of jobs is executed, and when the carrier 2500 isnot subjected to the loading treatment, subject the carrier 2500 to theloading treatment and execute the first job. In other words, when thetest conveyance of the wafer is started, if the carrier 2500 is in astate of having been subjected to the unloading treatment from thetreatment chamber, the control device 5 subjects the carrier 2500 to theloading treatment, thereby approaches the carrier 2500 to the treatmentchamber, and makes the carrier dock with the treatment chamber.

Subsequently, the control device 5 executes the first job out of theplurality of jobs concerning the test conveyance of the substrate.Specifically, the control device 5 takes the wafer out from the carrier2500, conveys the wafer in the treatment chamber, and returns the waferof which the conveyance has been finished to the carrier 2500. When thefirst job has been finished, the control device 5 executes a next job,without subjecting the carrier 2500 to the unloading treatment and theloading treatment (in state in which carrier 2500 is docked withtreatment chamber). By repeating this operation, the control device 5continuously executes the plurality of jobs, by executing the next jobafter one job has been finished, not through the unloading treatment andthe loading treatment.

In addition, the control device 5 can set the number of the wafers to beconveyed or the finish time, as a termination condition of thecontinuous execution of the plurality of jobs. The control device 5determines whether the termination condition is satisfied or not, whilethe plurality of jobs are continuously executed, and when thetermination condition has been satisfied, the control device 5 subjectsthe carrier 2500 to the unloading treatment and finishes the substratetest. Specifically, when the last job has been finished (terminationcondition has been satisfied), the control device 5 subjects the carrier2500 to the unloading treatment, and thereby moves the carrier 2500 awayfrom the treatment chamber and returns it to the predetermined place.

As has been described above, according to the present embodiment, thecarrier 2500 is not subjected to the loading treatment and the unloadingtreatment between the executions of the plurality of jobs, andaccordingly as a result, the plurality of jobs can be efficientlyexecuted.

In addition, the control device 5 can continuously execute the pluralityof jobs in order of registration or at random. According to thisoperation, the control device can continuously execute the plurality ofjobs in order of registration (order of creation) or at random,accordingly subject the wafer to the test conveyance in variousvariations, and as a result, contribute to the enhancement of thereliability of the CMP apparatus.

In addition, as has been described above, the carrier 2500 canaccommodate the plurality of wafers therein. The control device 5 canexecute the plurality of jobs on a wafer which has been assigned by theplurality of jobs, out of a plurality of wafers that have beenaccommodated in the carrier 2500. Thereby, the control device canexecute the test conveyance on an arbitrary wafer out of the pluralityof wafers that have been accommodated in the carrier 2500, andaccordingly can execute the test conveyance on the wafer, for instance,without the replacement of the wafers in the carrier 2500. As a result,the test conveyance of the wafer can be more efficiently performed.

Incidentally, in the present embodiment, it has been described that thewafer which has been accommodated in one carrier 2500 is subjected tothe test conveyance, but the present embodiment is not limited to thedescription, and a plurality of carriers 2500 can be also provided. Inthis case, the control device 5 can execute the plurality of jobssimultaneously (in parallel) on the wafers which have been accommodatedin each of the plurality of carriers 2500. Thereby, the plurality ofwafers which have been accommodated in the plurality of carriers 2500can be simultaneously subjected to the test conveyance, accordingly atime period of the test conveyance can be shortened, and as a result,the test conveyance of the wafer can be more efficiently performed.

<Control Flow Chart>

Next, a flow of processing by the control device 5 will be describedbelow. FIG. 21 is a view showing the flow of processing by the controldevice.

As is shown in FIG. 21, when the test conveyance of the wafer has beenstarted, the control device 5 determines whether the carrier 2500 isunloaded or not (whether carrier 2500 exists at predetermined positionwhich is distant from treatment chamber, or not) (step S2101).

Subsequently, when having determined that the carrier 2500 is unloaded(Yes, in step S2101), the control device 5 outputs a request to subjectthe carrier 2500 to the loading treatment (step S2102). Subsequently,the control device 5 determines whether the loading treatment of thecarrier 2500 has been finished or not (step S2103), and when havingdetermined that the loading treatment of the carrier 2500 is notfinished (No, in step S2103), the control device 5 repeats theprocessing of the step S2103.

Thereby, the carrier 2500 which exists in the predetermined positionthat is distant from the treatment chamber is subjected to the loadingtreatment, and as a result, the carrier 2500 approaches the treatmentchamber and is docked with the treatment chamber (CMP apparatus).Incidentally, the steps S2102 and 2103 are executed only in the casewhere the first job process out of the plurality of job processes isexecuted.

When having determined that the loading treatment of the carrier 2500has been finished (Yes, in step S2103), the control device 5 outputs arequest to start the corresponding job process out of the plurality ofjob processes to be executed (step S2104). Specifically, the controldevice 5 selects a job to be executed out of the plurality of jobs whichare stored in the storage device, and outputs a request to start theselected job process. Here, the job to be executed is a job whichcomplies with the order of the registration, in the case where theplurality of jobs are executed in order of the registration, and is ajob which has been selected at random, in the case where the pluralityof jobs are executed at random.

Subsequently, the control device 5 determines whether the job processhas been finished or not (step S2105), and when having determined thatthe job process is not finished (No, in step S2105), the control device5 repeats the processing of the step S2105.

Thereby, the CMP apparatus takes out the wafer from the carrier 2500according to the content of the job process which has been requested tobe started, conveys the taken out wafer in the treatment chamber, andreturns the wafer of which the conveyance has been finished, to thecarrier 2500.

Subsequently, the control device 5 determines whether the terminationcondition for the continuous execution of the plurality of jobs issatisfied or not (step S2106). As for the termination condition, thenumber of the wafers to be conveyed or the finish time, for instance,have been previously set, and can be stored in the storage device of thecontrol device 5, and the like.

When having determined that the termination condition has been satisfied(Yes, in step S2106), the control device 5 outputs a request to subjectthe carrier 2500 to the unloading treatment (step S2107), and finishesthe test conveyance treatment. Thereby, the carrier 2500 is undockedfrom the treatment chamber (CMP apparatus), is moved away from thetreatment chamber, and is returned to the predetermined place.Incidentally, the step S2107 is executed only after the last job processout of the plurality of job processes has been executed.

On the other hand, when having determined that the termination conditionis not satisfied (No, in step S2106), the control device 5 returns tothe processing of the step S2101, and repeats the processes after thestep S2101. Here, the control device 5 determines whether the carrier2500 is unloaded or not (step S2101), but when executing the jobs of thesecond time and later, the carrier 2500 is in a state of having beensubjected to the loading treatment, and accordingly the carrier 2500 isnot unloaded (No, in step S2101).

In this case, the control device 5 proceeds to the processing of thestep S2104, and outputs a request to start the corresponding job processout of the plurality of job processes to be executed (step S2104).

Thus, when the jobs of the second time and later are executed, the nextjob process is executed without the processing of subjecting the carrier2500 to the unloading treatment and the loading treatment after theexecution of the previous job has been finished. Accordingly, accordingto the present embodiment, the carrier 2500 is not subjected to theloading treatment and the unloading treatment between the executions ofthe plurality of jobs, and accordingly as a result, the plurality ofjobs can be efficiently executed.

REFERENCE SIGNS LIST

-   2 Loading/unloading unit-   3 Polishing unit-   4 Cleaning unit-   5 Control device-   250, 350 and 450 Components-   260, 360 and 460 Sequencers-   510 Interface-related APSW-   512 Recipe-editing APSW-   514 APSW for creating job for automatic conveyance-   516 APSW for operating single body of unit-   518 Parameter-editing APSW-   520 Control-related APSW-   522 Recipe management APSW-   524 Job management/control APSW-   526 APSW for operating single body of unit-   528 Parameter management APSW-   530 Task monitoring APSW-   540 Shared memory-   550 Display device-   560 Communication driver-   610 Title display region-   620 Submenu display region-   630 Main menu display region-   640 Display region-   650 Submenu button-   660 Main menu button-   1512 Input operation unit-   1514 Storage unit-   1516 Display unit-   1520 Display control device-   1522 Receiving unit-   1524 Storage control unit-   1526 Display control unit-   1608 Base image-   1620 Monitoring-related image-   1630, 640 and 650 Operation-related images-   2500 Carrier-   W Wafer

What is claimed is:
 1. A substrate treatment apparatus comprising: atreatment chamber configured to polish or clean a substrate therein; anda control device configured to continuously execute a plurality of jobsconcerning a test conveyance of the substrate in the treatment chamber,wherein the control device continuously executes the plurality of jobsnot through an unloading treatment of moving a carrier whichaccommodates the substrate therein away from the treatment chamber, andnot through a loading treatment of approaching the carrier to thetreatment chamber, between the plurality of jobs.
 2. The substratetreatment apparatus according to claim 1, wherein the control devicecontinuously executes the plurality of jobs in order of registration orat random.
 3. The substrate treatment apparatus according to claim 1,wherein the carrier can accommodate a plurality of substrates therein,and the control device executes the plurality of jobs to a substratewhich has been assigned by the plurality of jobs, out of a plurality ofsubstrates that have been accommodated in the carrier.
 4. The substratetreatment apparatus according to claim 1, wherein the control devicedetermines whether the carrier is subjected to the loading treatment ornot, before the first job out of the plurality of jobs is executed, andwhen the carrier is not subjected to the loading treatment, subjects thecarrier to the loading treatment and executes the first job.
 5. Thesubstrate treatment apparatus according to claim 1, wherein thesubstrate treatment apparatus can set the number of the substrates to beconveyed or the finish time, as a termination condition for continuousexecution of the plurality of jobs, and the control device determineswhether the termination condition is satisfied or not while theplurality of jobs are continuously executed, and when the terminationcondition has been satisfied, subjects the carrier to the unloadingtreatment and finishes the substrate test.
 6. The substrate treatmentapparatus according to claim 1, wherein the plurality of carriers areprovided, and the control device executes the plurality of jobssimultaneously to the substrates which are accommodated in each of theplurality of carriers.